ʻO Bisphenol ss no .: 80-09-1
Kāheaʻia:44'-sulfony>
Molecular Reccan ALBula:C12h10o4s
Molele mollecular:250.3
Palapala NO .:80-09-1
Stuctural formula:
| ʻO nā huahana kiʻekiʻe kiʻekiʻe (1) | Nā huahana kiʻekiʻe (2) | Huahana mākaukau | Huahana maʻamau | Waiwai waiwai | Waiwai waiwai | Cude | Cude | |
| 4,4 '-diyddroxyditdiphenyl sulfone karityolution%%% (HPLC) | 99.9 | 99.8 | 99.7 | 99.5 | 98 | 97 | 96 | 95 |
| 2, | 0.1 | 0.2 | 0.3 | 0,5 | 2 | 3 | 3 | 4 |
| Menging Point ° C | 246-250 | 246-250 | 246-250 | 245-250 | 243-248 | 243-248 | 238-245 | 220-230 |
| Morest ≤% | 0.1 | 0.1 | 0,5 | 0,5 | 0,5 | 0,5 | 1.0 | 1.0 |
| APHA | 10-20 | 20-30 | 100-150 | Keʻokeʻo keʻokeʻo | Keʻokeʻo keʻokeʻo | Keʻokeʻo i ke keʻokeʻo-keʻokeʻo | ʻUlaʻula a iʻole ka pala | ʻUlaʻula a iʻole ka pala |
| ka heluʻana ma o ka hoʻohanaʻana | I nā kiʻi, polycarbonal a me ka epoxb resin etc. | I ka hanaʻana o nā mea momona momona a me ke kiʻekiʻe a me ka papa kiʻekiʻe | Ma ka hanaʻana o ka paʻiʻana a me nā hōʻai'ē hōʻai'ē a me nā mea hoʻokele kaʻa kaʻa | |||||
PKauwa Kaoaohai:
Kākau:Kalaʻole a me nā meaʻala a iʻole ka pohō keʻokeʻo.
E hoʻohana:
- ʻO ka molelani s Molecule S Moleculeʻelua mau pūʻulu hydroxyl a me kahi mea hou e hoʻihoʻi hou ana i ka sulfone, acidic ma mua o nā phenols'ē aʻe.
- Hoʻohana nuiʻiaʻo Bisphenol i kahi luna hoʻoponopono. Hiki ke hanaʻia ka luna hoʻoponopono no nā mea kila me ka bisphenol s A.
- He wela wela ka wela, ke paleʻana o ke kukui a me ka pale kaulikeʻana,raw notNa Poolcarbaldate, Epoxy Resin and Polyoulfide, Poletera Sulfone, Poletera Rensin Etc.
- Hoʻohana pūʻia i ka hanaʻana o nā kiʻi kiʻi kiʻiʻoniʻoni ʻO Pesti Fortic, Deses, Auxiliriaries, hiki ke hoʻohana pūʻia i loko o ka pena, a me nā'āpana o ke kukui māmā
Paina a me ka waiho ana
1. 25kgʻeke
2. E kūʻai i ka huahana ma kahi papa maloʻo, maloʻo, maikaʻi loa i kahi wahi i halaʻoleʻia mai nā mea waiwai.
Kākau i kāu leka uila maʻaneʻi a hoʻouna iā mākou