Ka ʻIke Huahana
Inoa huahana: 6-(2,5-Dihydroxyphenyl)-6H-dibenz[c,e][1,2]oxaphosphorine-6-oxide
Helu CAS: 99208-50-1
Kaumaha molekole: 324.28
ʻO ke ʻano molekala: C18H13O4P
ʻAno hoʻonohonoho

Waiwai
| Ka nui | 1.38-1.4 (25 ℃) |
| Kiko heheʻe | 245℃~253℃ |
Papa kuhikuhi loea
| helehelena | Pauka keʻokeʻo |
| Hoʻāʻo (HPLC) | ≥99.1% |
| P | ≥9.5% |
| Cl | ≤50ppm |
| Fe | ≤20ppm |
Noi
ʻO Plamtar-DOPO-HQ kahi mea pale ahi phosphate halogen-free hou, no ka resin epoxy kiʻekiʻe e like me PCB, e pani iā TBBA, a i ʻole ka mea hoʻopili no ka semiconductor, PCB, LED a pēlā aku. Waena no ka synthesis o ka mea pale ahi reactive.
Ka Hoʻopili ʻana a me ka Mālama ʻana
E mālama i kahi maloʻo a anuanu. E mālama ʻia mai nā kumu wela a pale i ka ʻike pololei ʻana i ka mālamalama.
20KG/ʻeke (ʻeke pepa i hoʻopaʻa ʻia me ka palakiko) a i ʻole e like me nā koi a ka mea kūʻai aku.