• Debon

ʻO Dopo non-hallgen reactive Retadants

ʻO nā mea kūʻai aku no Non-Halzen reactive Retadants no nā hoʻopakele epoxy, hiki ke hoʻohanaʻia ma PCB a me nā mea ep, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP Ka palena o ka flame retardant a me nā mea kanu'ē aʻe.


  • Hua inoa huahana:9,10-dishdro-9-oxa-10-phosphaprene-10-Oxide
  • Molecular Reccan ALBula:C12h9op
  • Molele mollecular:216.16
  • Palapala NO .:35948-25-5
  • Huahana kikoʻipiop

    Nā Kūlana Huakaʻi

    Hōʻike huahana
    Hua'ōlelo huahana: 9,10-dishdro-9-oxa-10-phosphaprene-10-Oxide
    FEBBENCIANT: DOPO
    Cas no .: 35948-25-5
    Molele mollecular: 216.16
    Molecular kiko'ī: C12h9O2O2P
    ʻAnoʻano hana

    Dop

    Waiwai

    KālāHuna 1402 (30 ℃)
    Malting Point 116 ℃ -120 ℃
    Makaʻikua 200 ℃ (1MSHG)

    Noiʻi

    Helehelena keʻokeʻo keʻokeʻo a keʻokeʻo paha
    Assoay (HPLC) ≥9s.0%
    P ≥14.0%
    Cl ≤50pl
    Fe ≤20ppm

    Noi
    ʻO nā mea kūʻai aku no Non-Halzen reactive Retadants no nā hoʻopakele epoxy, hiki ke hoʻohanaʻia ma PCB a me nā mea ep, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP, PP Ka palena o ka flame retardant a me nā mea kanu'ē aʻe.

    PAKAI
    25 kg /ʻeke.

    Huanui
    E kūʻai ma kahi maloʻo maloʻo, maloʻo, maikaʻi, mai ka oxidizer ikaika.


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  • ANE:

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