Hoʻolauna
Methylhexahydrophthalic anhydride, MHHPA
Ka helu CAS: 25550-51-0
Huahana Huahana
| Ka wai kala ʻole | |
| Kala/Hazen | ≤20 |
| maʻiʻo,% | 99.0 Min. |
| Waiwai Iodine | ≤1.0 |
| ʻO Viscosity (25 ℃) 40mPa•s Min | |
| ʻAkika manuahi | ≤1.0% |
| Lae hau | ≤-15 ℃ |
| Hui Pū ʻIa | C9H12O3 |
Ke Kino A me Kemika
| Kūlana Kino (25 ℃) | Waiwai |
| Ka nana aku | wai kala ʻole |
| Kaumaha Molekala | 168.19 |
| Kaumaha Kūikawā (25/4 ℃) | 1.162 |
| Hiki i ka wai | decomposes |
| Hiki ke hoʻoheheʻe | Hiki ke hoʻoheheʻe ʻia: petroleum ether Hiki ke ʻae: benzene, toluene, acetone, carbon tetrachloride, chloroform, ethanol, ethyl acetate |
Nā noi
Epoxy resin curing agents etc.
ʻO ka MHHPA kahi mea hoʻoponopono epoxy resin curing agent i hoʻohana nui ʻia ma ke kahua uila a me ka electron. Me nā pono he nui, e laʻa me ka helu heheʻe haʻahaʻa, haʻahaʻa viscosity o nā hui me ka salicylic epoxy resins, lōʻihi ka manawa kūpono, kiʻekiʻe wela-kū'ē o ka mea ho'ōla a me nā waiwai uila maikaʻi loa i ka wela kiʻekiʻe, hoʻohana nui ʻia ʻo MHHPA no ka hoʻopili ʻana i nā wili uila, hoʻolei ʻana i nā ʻāpana uila a hoʻopaʻa i nā Semiconductor, eg.
Hoʻopili
Hoʻopili ʻia i loko o 25 kg pahu plastik a i ʻole 220kg pahu hao a i ʻole isotank.
Waihona
E mālama i nā wahi maloʻo maloʻo a pale i ke ahi a me ka maʻamau.