• DEBORN

ʻO ka anhydride Methylhexahydrophthalic (MHHPA)

Nā mea hoʻōla resin epoxy a pēlā aku.

He mea hoʻōla thermo-setting epoxy resin ʻo MHHPA i hoʻohana nui ʻia ma ke kahua uila a me ke kahua electron.


  • Waihoʻoluʻu/Hazen:≤20
  • ʻIkepili,%:99.0 Min
  • Ka Waiwai Lodine:≤1.0
  • Helu CAS:25550-51-0
  • Nā kikoʻī huahana

    Nā Lepili Huahana

    Hoʻolauna
    ʻO ka anhydride Methylhexahydrophthalic, MHHPA
    Helu CAS: 25550-51-0

    Nā kikoʻī huahana

    ʻAno Wai kala ʻole
    Waihoʻoluʻu/Hazen ≤20
    ʻIke,% 99.0 Min.
    Ka Waiwai Iodine ≤1.0
    Ka mānoanoa (25 ℃) 40mPa•s Min 
    ʻAkika manuahi ≤1.0%
    Kiko Paʻahau ≤-15℃
    Formula Kūkulu C9H12O3

    Nā ʻano kino a me nā kemika

    Kūlana Kino (25 ℃) Wai
    helehelena Wai kala ʻole
    Kaumaha Molekala 168.19
    Ka Umekaumaha Kūikawā (25/4 ℃) 1.162
    Ka hoʻoheheʻe ʻana i ka wai palaho
    Ka hoʻoheheʻe ʻana o ka mea hoʻoheheʻe Hoʻoheheʻe iki ʻia: petroleum ether Hoʻohuihui ʻia: benzene, toluene, acetone, carbon tetrachloride, chloroform, ethanol, ethyl acetate

    Nā noi
    Nā mea hoʻōla resin epoxy a pēlā aku.
    He mea hoʻōla resin epoxy thermo-setting ʻo MHHPA i hoʻohana nui ʻia ma ke kahua uila a me ke kahua electron. Me nā pono he nui, e laʻa me ke kiko heheʻe haʻahaʻa, ka viscosity haʻahaʻa o nā hui ʻana me nā resins epoxy salicylic, ka lōʻihi o ka manawa hoʻohana, ke kūpaʻa wela kiʻekiʻe o ka mea i hoʻōla ʻia a me nā waiwai uila maikaʻi loa i ka mahana kiʻekiʻe, hoʻohana nui ʻia ʻo MHHPA no ka hoʻopili ʻana i nā wili uila, ka hoʻolei ʻana i nā ʻāpana uila a me ka sila ʻana i nā semiconductors, e laʻa me nā insulators waho, nā capacitors, nā diodes hoʻopuka kukui a me ka hōʻike kikohoʻe.

    Hoʻopili ʻana
    Hoʻopaʻa ʻia i loko o nā pahu plastik 25 kg a i ʻole nā ​​​​pahu hao 220kg a i ʻole ka pahu iso.

    Ka Waihona
    E mālama i nā wahi maloʻo a me kahi anuanu, a mālama ʻia mai ke ahi a me ka makū.


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