• Debon

TGIC (SEVERSIVERS)

1.ʻO ka hoʻopiliʻana o ka curing curing curing o PA.

2. No ka hoʻomākaukauʻana i nā mea uila o nā mea hoʻohana uila kiʻekiʻe.


  • Hua inoa huahana:Triglycidl lsoyanurat (Electronic)
  • Palapala NO .:2451-62-9
  • Molecular Reccan ALBula:C12h15n6
  • Molele mollecular:297
  • Huahana kikoʻipiop

    Nā Kūlana Huakaʻi

    Noiʻi

    ʻO nā mea ho'āʻo Tgic-e Tgic-m Tgic-2m Tgic-h
    Helehelena Keʻokeʻo keʻokeʻo Keʻokeʻo keʻokeʻo Keʻokeʻo keʻokeʻo Keʻokeʻo keʻokeʻo
    Nā kikowaena Mellotings (℃) 95-110 100-110 100-125 150-1660
    EPOXIDID EPOXIDE (G / EQ) 95-110 100-105 100-105 100-105
    Huina cliride (ppm) ≤ 4000 2400 900 900
    Collatile mea (%) ≤ 0.3 0.2 0.2 0.2

    Noi
    ʻO TGIC kahiʻano o ka heterorcyclic kani i ka hui epoxyclic epoxy. He wela wela ka wela, ke paleʻana i ka paleʻana, ke paleʻana a me ka waiwai kiʻekiʻe. Ua hoʻohana nuiʻia ia e like me:
    1.Cross-Linking curing curing o PA.
    2.No ka hoʻomākaukauʻana i ka waiwai o ka hoʻohanaʻana i nā mea hoʻohana uila kiʻekiʻe.

    Paliole
    25Kg /ʻeke

    Huanui
    pono e mālamaʻia ma kahi maloʻo a maloʻo


  • MAUI:
  • ANE:

  • Kākau i kāu leka uila maʻaneʻi a hoʻouna iā mākou