• DEBORN

Methylhexahydrophthalic anhydride (MHHPA)

Epoxy resin curing agents etc.

ʻO ka MHHPA kahi mea hoʻoponopono epoxy resin curing agent i hoʻohana nui ʻia ma ke kahua uila a me ka electron.


  • kala/Hazen:≤20
  • Maʻiʻo,%:99.0 Min
  • Waiwai Lodine:≤1.0
  • Helu CAS:25550-51-0
  • Huahana Huahana

    Huahana Huahana

    Hoʻolauna
    Methylhexahydrophthalic anhydride, MHHPA
    Ka helu CAS: 25550-51-0

    Huahana Huahana

    Ka wai kala ʻole
    Kalai/Hazen ≤20
    maʻiʻo,% 99.0 Min.
    Waiwai Iodine ≤1.0
    ʻO Viscosity (25 ℃) 40mPa•s Min 
    ʻAkika manuahi ≤1.0%
    Lae hau ≤-15 ℃
    Hui Pū ʻIa C9H12O3

    Ke Kino A me Kemika

    Kūlana Kino (25 ℃) Waiwai
    Ka nana aku wai kala ʻole
    Kaumaha Molekala 168.19
    Kaumaha Kūikawā (25/4 ℃) 1.162
    Hiki i ka wai decomposes
    Hiki ke hoʻoheheʻe Hiki ke hoʻoheheʻe ʻia: petroleum ether Hiki ke ʻae: benzene, toluene, acetone, carbon tetrachloride, chloroform, ethanol, ethyl acetate

    Nā noi
    Epoxy resin curing agents etc.
    ʻO ka MHHPA kahi mea hoʻoponopono epoxy resin curing agent i hoʻohana nui ʻia ma ke kahua uila a me ka electron. Me nā pōmaikaʻi he nui, e laʻa me ka helu heheʻe haʻahaʻa, haʻahaʻa haʻahaʻa o ka hui ʻana me ka salicylic epoxy resins, lōʻihi ka manawa kūpono, kiʻekiʻe ka wela o ka mea i ho'ōla ʻia a me nā waiwai uila maikaʻi loa i ka wela kiʻekiʻe, hoʻohana nui ʻia ʻo MHHPA no ka hoʻopili ʻana i nā wili uila, hoʻolei. nā ʻāpana uila a me nā semiconductor hoʻopaʻa, e laʻa me nā insulators waho, nā capacitors, nā diodes māmā a me ka hōʻike kikohoʻe.

    Hoʻopili
    Hoʻopili ʻia i loko o 25 kg pahu plastik a i ʻole 220kg pahu hao a i ʻole isotank.

    Waihona
    E mālama i nā wahi maloʻo maloʻo a pale i ke ahi a me ka maʻamau.


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